Just a few days ago it was revealed Huawei had been granted a patent related to a design process that would allow the creation of future smartphones with no side bezels. Interestingly, however, it appears Samsung has been working on a very similar method, as depicted in its latest patent that was granted earlier today.
Although Huawei’s design process allowed for the removal of side bezels, the brand’s use of a rear panel still resulted in a smartphone that featured thicker top and bottom bezels, something Samsung’s patent does away with entirely.
