Apple and Intel will be the first to adopt Taiwan Semiconductor Manufacturing Co.’s (TSMC) N3 (3nm) fabrication process when the contract maker of chips deploys in late 2022, Nikkei Asia news agency reported on Friday. Intel is projected to use the technology to make CPUs for PCs and servers, whereas Apple is expected to use the node for its system-on-chips aimed at client devices.
Apple and Intel are currently ‘testing their chip designs’ produced using TSMC’s N3 process, according to a Nikkei report that cites several people with knowledge of the matter.
