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Computing, Hardware

Intel’s 3D-stacked Lakefield chips are here to take on ARM in laptops, tablets, and foldables

June 10, 2020

Via: The Verge

Intel’s 3D-stacked Lakefield processors are finally getting an official debut after months of previews, promising to bring a smaller, more versatile chipset option to hardware manufacturers for new ultraportable, foldable, and dual-screen devices in what might be Intel’s best answer […]